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Keeping in mind that it usually takes companies about a year to start high-volume manufacturing (HVM) after the beginning of risk production, expect N6 to be used for mass products starting from 2021.

From 14nm to 10nm Intel targeted a 2.7x density target which led to even more manufacturing challenges. TSMC will deliver 5nm in 2020 and 3nm (also a FinFET based technology) is scheduled for 2022.

Remember, TSMC is on the Apple iProducts schedule so they have to be in HVM early in the year versus late for Apple to deliver systems in Q4.

Those TSMC clients that need a ~ 18~20% higher transistor density are expected to use N7+ and N6 process technologies that use extreme ultraviolet (EUV) lithography for several layers.While both N7 and N6 will be ‘long’ nodes that will be used for years to come, TSMC’s next major node with substantial density, power, and performance improvements is N5 (5 nm). 22nm to 14nm had a 2.4x density target which as we now know was a very difficult transition. Furthermore, according to TSMC N6 'leverages new capabilities in extreme ultraviolet lithography (EUVL)' gained from N7+, but does not disclose how exactly it uses EUV for the particular technology.
The most interesting comments to me were in relation to TSMC. Intel 10nm was officially launched in 2019 and Intel 7nm is scheduled for late 2021 which I have no doubt they will hit given the above targets.I am at IEDM 2019 this week with SemiWiki bloggers Scott Jones and Don Draper (new blogger) so stay tuned. The portion in the red box indicates Intel has booked a product at TSMC's 6nm process along with orders on 7nm and 7nm+ from AMD. Making a FinFET to FinFET process equivalency statement is fine but from what I was told Intel will be using Nanosheets at 5nm.Remember, Intel was on a two year process cadence until 14nm. Please refresh the page and try again.©Future US, Inc. 11 West 42nd Street, 15th Floor,New York,NY 10036.Intel's 7nm will be equivalent to TSMC's 5nm process, but a year later.Although none of this means Intel still isn’t in a much stronger position both brand and financially-wise compared to AMD and TSMC and that it can’t recover, it’s still a trend that doesn’t do Intel any favors and that Intel will have to reverse before it’s too late.Intel then switched to 14nm, and that wasn’t a very smooth ride either. TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready TSMC: 7nm Now Biggest Share of Revenue TSMC: First 7nm EUV Chips Taped Out, 5nm Risk Production in Q2 2019

And with AMD’s next CPUs on TSMC’s 7nm process, this marks a chance for them to jump past Intel in performance, and bring some healthy competition to Intel’s monopoly on the market—at least until Intel’s 10nm “Sunny Cove” chips start hitting shelves. 7nm EUV stochastic failure probability. TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process.

What The “nm” Really Means fotografos/Shutterstock. TSMC this week unveiled its new 6 nm (CLN6FF, N6) manufacturing technology, which is set to deliver a considerably higher transistor density when compared to the company's 7 nm (CLN7FF, N7) fabrication process.

TSMC's 5nm yields reportedly cross 7nm, AMD hinted as a customer for Zen 4's 2021 launch TSMC is the world's leading fabricator of cutting-edge silicon, this fact is undeniable, especially as Intel's 10nm problems persist and Samsung remains unable to generate similar levels of interest in its own 7nm …
7nm features are expected to approach ~20 nm width. TSMC is giving a paper on 5nm and of course the chatter in the hallways has even more content.TSMC on the other hand delivered 16nm in 2015, 10nm in 2017, and 7nm in 2018.

The technology will be used for risk production of chips starting Q1 2020.TSMC says that it expects N6 to be used for a variety of applications, including mobile SoCs, GPUs, high-performance computing chips, networking, 5G infrastructure, and other products. You can expect 5nm+ to fill in the gap year just as 7nm+ did in 2019.

These findings were further corroborated by Chinatimes as well. Dozens of articles hit the internet by people who have no idea what they are talking about so don’t waste your time.Bob also talks about Intel’s transitions from 22nm to 14nm to 10nm in very simple terms. He … For one, it was on a smaller 22nm process compared to others who were just moving to 28nm/32nm process nodes. Perhaps, companies with complex N7-based chips will prefer to go directly to N7+, or even 5 nm (CLN5FF, N5), for their next generation parts.TSMC states that their N6 fabrication technology offers 18% higher logic density when compared to the company’s N7 process (1st Gen 7 nm, DUV-only), yet offers the same performance and power consumption. He also said that Intel 5nm will be equivalent to TSMC’s 3nm to which I am not so sure.